Processing instructions for removers
Substrates coated with resist are exposed to the effect of the remover by immersion (puddle or dip). To reduce the dissolution time for tempered layers, removers AR 300-70, 300-72 and 300-76 may be heated to up to 80 °C, remover AR 300-73 to up to 50 °C or megasound may be helpful in this case. It is recommended to rinse off the remover with DI water, clean remover or with a suitable thinner. A stripping of very hard-baked layers (> 220 °C) with remover is hardly possible any more. In this case, oxidizing acids or oxygen plasma may be used for stripping. Further detailed remover specifications for a large variety of resists are listed on the following pages.
已塗有阻劑的基板浸泡於(puddle or dip)去除劑,將阻劑膜剝除. 為降低阻劑膜溶解時間, 去除劑AR 300-70, AR 300-72及AR 300-76可加熱至80℃; AR 300-73可加熱至50℃. 或施以兆聲波(megasonic)輔助清洗.
去除程序後,建議以DI water或稀釋液以清洗殘留去除液.
對於經過大於220℃高溫硬烤的阻劑,去除劑基苯上已很難作用,可使用酸性氧化或電漿去除.
更詳細及適用範圍,請參考下頁.