This diagram shows exemplary process steps for AR-P 5300series resists. All specifications are guideline values which must be adapted to own specific conditions. For further information on processing, 👉“ Detailed instructions for optimum processing of photoresists”. For recommendations on wastewater treatment and general safety instructions, 👉”General product information on Allresist photoresists”.

圖示AR-P 5300系列產品製程參數的範例. 所有參數為參考值,使用者應依設備環境實際狀況加以調整

Processing instructions

Tempering: 

Higher tempering temperatures are required to produce the undercut.

軟烤: 

形成下切式結構需較高的軟烤溫度

Development: 

The undercut of resist structures is generated during aqueous-alkaline development.

顯影: 

下切式結構是在鹼性水溶液顯影程序下形成