AR-N 4600 series (Atlas 46) negative photoresist for high film thickness
for the application of electroplating, micro-systems and LIGA < 20 μm
Process baseline
This diagram shows exemplary process steps for resist AR-N 4600. All specifications are guideline values which must be adapted to own specific conditions. For further information on processing ,☞ “ Detailed instructions for optimum processing of photoresists”. For recommendations on wastewater treatment and general safety instructions ☞” General product information on Allresist photoresists”.
圖示AR-N 4600系列產品製程參數的範例. 所有參數為參考值,使用者應依設備環境實際狀況加以調整
Development recommendations
Product quick guide 產品快速導覽▶️ EBL resist 電子束微影阻劑▶️ tSPL resist 熱掃描微影阻劑▶️ Conductive coating 導電塗佈▶️ Photoresist 光阻劑▶️ Protective resist 保護塗層▶️ Bottom resist 底層阻劑▶️ Process chemicals 製程化學品