Thick Positive Photoresists AR-P 3200series

For the application of electroplating and micro-systems technology

Processing instructions (for the processing of thick films > 40 μm)


Coating should be performed in two or several steps using the same procedure. After a low initial spin speed (30 s), a main spin speed of 250 – 500 rpm for at least 2-5 min should be chosen. A brief subsequent spinning off at 600 – 800 rpm for 5 s reduces edge bead formation.


建議採用兩次或多次同參數的累加塗佈. 先以30秒低轉速讓光阻分佈於基板,隨後主轉速250 - 500轉約2 - 5分鐘. 最後提高轉速至600-800轉約5秒以減少邊緣隆起形成.


Tempering should be performed in 2 steps: 1. 75 °C, 5 min hot plate or 70 °C, 30 min convection oven; 2. 90 °C, 20 min hot plate or 90 °C, 80 min convection oven. After tempering, a slow cooling is recommended to avoid stress cracks.


建議兩階段軟烤以乾燥厚膜光阻; 1. 75℃ x 5min 熱板,或 70℃ x 30 min對流烤箱. 2. 90℃ x 20 min 熱板或90℃ x 80 min對流烤箱. 冷卻應緩慢降溫以避免應力造成裂痕.

The transparency of AR-P 3220 is higher as compared to AR-P 3210, due to the lower concentration of the PAC. The gradation is accordingly relatively low. This fact can be used for the fabrication of three-dimensional structures using grey tone masks with AR-3220. Different exposure doses will result in different resist film thicknesses.