SXAR-P 3500-8 photoresist for high temperature

SXAR-P 3500/8 photoresist for high temperature (300℃) application

產品特性:

SXAR-P 3500/8 photoresist for high temperature (300℃) application

features:

    • broadband, i-line, g-line
    • high plasma resistant, thermally stable up to 300 °C
    • suitable for: high-temperature 2-layer lift-off processes as well as plasma etching and implantation processes
    • combination of poly(hydroxystyrene-co-MMA)- naphthoquinone diazide
    • safer solvent PGMEA
    • Product series:
      • SXAR-P 3500/8