SXAR-N 4340-7 thermal stable negative resist

SXAR-N 4340/7 thermal stable (300℃) negative photoresist

features:

• i-line, g-line, deep UV (248 – 266 nm)
• highest sensitivity, high resolution
• good adhesion properties, high contrast, chemically enhanced
• undercut profiles (lift-off) possible
• may be used with AR-BR 5400 as 2-layer system
• plasma etching stable, thermostable up to 300 °C
• polyhydroxystyrene polymer, higher photosensitivity
• acid generator and aminic cross-linker
• safer solvent PGMEA
  • Product series:
    • SXAR-N 4340/7