composition action mode & properties

Overview

of composition, mode of action and specific properties

of photoresists

Photoresists (photo coatings) are in particular used in microelectronics and micro-systems technology for the fabrication of μm- and sub-μm-structures.

Resists are in most cases applied by spin coating. For thin resists, the optimum

rotational speed ranges from 2000 to 4000 rpm, for thick resists between 250 and 2000 rpm. Generally utilizable is a spin speed of up to 9000 rpm to generate films of 30 nm to 200 μm depending on the respective type of resist used. Thicker films of up to 1 mm can be fabricated with casting procedures.

Alternative coating techniques are e.g. dip coating (for large and/or substrates

with irregular surface geometry) and spray coating (for highly structured topologies, for complicated substrate shapes) or roller coating procedures.

Allresist offers a large variety of different types of resists which cover a wide range of possible applications:

光阻成份, 作用模式及特性概述:

光阻廣泛應用於微電子及微系統的微米及次微米結構製程, 一般以旋轉塗佈法塗佈於基板表面. 薄膜光阻適合的旋轉速度約2000 rpm – 4000 rpm. 厚膜光阻旋轉速度約微250 rpm – 2000 rpm. 一般而言, 依所使用光阻的特性, 從低轉速到9000轉可得介於30nm到200um的膜厚. 膜厚達1mm採用不同方法,例如澆注式. 其它的塗佈技術, 例如, 沉浸式,適合大面積或表面不規則結構. 噴塗式適合基板已有高深結構,或複雜形狀. 滾筒塗佈法亦常被採用.

ALLRESIST提供完整產品線,適合各類型應用:

    • positive photoresist 正型光阻
    • image reversal resists 反轉型光阻
    • negative photoresist 負型光阻
    • thick layer photoresist 厚膜光阻
    • resist for lift-off applications 下切結構lift-off光阻
    • Protective coatings 保護材, 介電材
    • user-oriented photoresists 客製化材料