AR-P 5300 series photoresist for lift off

AR-P 5300 series photoresist for lift-off application

產品特性:

AR-P 5300 series photoresist for lift-off application

features:

  • broadband UV, i-line, g-line
  • high photosensitivity, high resolution
  • good adhesion properties
  • for undercut structures
  • for the production of evaporation samples, in particular of metal using lift-off techniques e.g. for conductor paths
  • plasma etching resistant, temperature stable up to 120 °C
  • combination of novolac and naphthoquinone diazide
  • safer solvent PGMEA
    • Product series:
      • AR-P 5320
      • AR-P 5350