AR-N 4400 series thick layer photoresist

AR-N thick layer photoresist for electroplating, microsystem

產品特性:

AR-N thick layer photoresist for electroplating, microsystem

features:

broadband UV, i-line, g-line, e-beam, X-ray, synchrotron
chemically enhanced, very good adhesion, electro plating-stable
very high sensitivity, easy removal
profiles with high edge steepness for excellent resolution, covering of topologies
4400-05 for films up to 10µm (250 rpm)
4400-10 for films up to 20um (250 rpm)
4450-10 for film thicknesses up to 20 µm and lift-off
novolac, crosslinking agent, amine-based acid generato
safer solvent PGMEA