AR-N 4400 series thick layer photoresist
AR-N thick layer photoresist for electroplating, microsystem
產品特性:
AR-N thick layer photoresist for electroplating, microsystem
features:
- broadband UV, i-line, g-line, e-beam, X-ray, synchrotron
- chemically enhanced, very good adhesion, electro plating-stable
- very high sensitivity, easy removal
- profiles with high edge steepness for excellent resolution, covering of topologies
- 4400-05 for films up to 10µm (250 rpm)
- 4400-10 for films up to 20um (250 rpm)
- 4450-10 for film thicknesses up to 20 µm and lift-off
- novolac, crosslinking agent, amine-based acid generato
- safer solvent PGMEA
- AR-N 4400-05
- AR-N 4400-10
- AR-N 4450-10
- AR-N 4400-25
- AR-N 4400-50