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Techpoint Taiwan Corp.
  • home
    • about us
  • Product & Application
    • e-beam lithography
      • about Allresist e-Beam resist
        • a product landscape
        • allresist e-Beam resist - general
          • 1. overview
          • 2. type of polymer
          • 3. stability and optimum storage condition
        • detail process description
          • 0. Adhesion - substrate pretreatment
          • 1. Coating
          • 2. Tempering / Softbake
          • 3. Exposure
          • 4. Development
          • 5. Rinse
          • 6. Postbake / Hardbake
          • 7. Customer-specific technologies
          • 8. Removal
      • AR-N 7500 series - mix & match
      • AR-N 7520 series - mix & match
      • AR-N 7520-new series - mix & match
      • AR-N 7700 series with steep gradation
      • AR-N 7720 with flat gradation
      • AR-P 610 series copolymer resist
        • AR-P 617 features
        • correlation
        • liftoff process
        • Planarization
        • process baseline
        • Properties I
        • Properties II
        • reaction mechanism
        • spin curve
        • structure and resolution
      • AR-P 6200 series highest resolution
        • a. Features
        • b. Properties
        • c. Spin Curve
        • d. Structure & Resolution
        • e. Process Baseline
        • f. Plasma Etching Rate
        • g. Process Instruction
          • 01. ebeam exposure
          • 02. development
          • 03. lift-off structures
          • 04. high TH layer & special applications
        • h. Application Examples
          • 01. mask blanks
          • 02. plasmonic nanomaterials
          • 03. highest resolution nanolithography
          • 04. lift-off - high TH/high AR
          • 05. 2L lift-off structure
          • 06. high precision square structure
          • 07. development at lower temperature
          • 08 nano structures written with 100 kV
          • 09. developer for T-gate structure
        • i. Comparison vs. ZEP 520A
          • 01. resolution
          • 02. contrast
          • 03. sensitivity
      • AR-P 630-670 series PMMA resist
        • 2 layers PMMA structures
        • Application Example of PMMA resists
        • comparison-50k/200k vs 600k/950k
        • features
        • Process Baseline
        • properties
        • Reaction Mechanism
        • recommend on coating
        • Sensitivity & Acceleration Voltage
        • Specification of PMMA Resist
        • spin curve
        • structure resolution
        • Under-cut versus Dose
        • Undercut-application example
      • AR-P 6500 series ultra-high TH
        • coating instruction
        • features
        • process baseline
        • properties
        • structure and resolution
      • AR-P 7400 for mix & match
        • features
        • process baseline-negative
        • process baseline-positive
        • properties
        • spin curve
        • structure resolution
      • AR-PC 5090-5091 conductive coating
      • SXAR-N 7530/1 white light resist
      • SXAR-N 7700/30 high sensitive resist
      • SXAR-N 7730/1 high gradation
    • lithography process chemicals
      • adhesion promoter
        • adhesion strength
        • features
        • process baseline-ar300-80
        • process baseline-HMDS
        • properties
      • developer
      • remover
      • stopper
      • thinner
        • dilution and formula
        • features
        • properties
    • photoresist
      • AR-BR 5400 series bottom resist
      • AR-N 2200 series spray photoresist
      • AR-N 4200 mid-deep UV photoresist
      • AR-N 4300 std mid-UV photoresist
      • AR-N 4400 series thick layer photoresist
      • AR-P 1200 series spray photoresist
      • AR-P 3100 series photoresist for mask
      • AR-P 3200 series thick layer
      • AR-P 3500 series std photoresist for IC
      • AR-P 3700 std photoresist for IC
      • AR-P 3800 high resolution PR for IC
      • AR-P 5300 series photoresist for lift off
      • AR-P 5900 photoresist for HF etching
      • AR-PC 500 series protection coating
      • AR-U 4000 series image reversal resist
      • overview of photoresist
        • general information on photoresist
          • composition action mode & properties
          • stability & storage condition
          • waste & safety instruction
          • 0. positive photoresist
          • 1. image reversal resists
          • 2. negative photoresist
          • 3. thick layer photoresist
          • 4. lift-off applications
          • 5. Protective coatings
          • 6. special resist
          • 7. user-oriented photoresists
        • optimum process of photoresist
          • 0. Adhesion
          • 1. Coating
          • 2. Tempering / Softbake
          • 3. Exposure
          • 4. Development
          • 5. Rinse
          • 6. Postbake / hardbake
          • 7. Customer-specific technologies
          • 8. Removal
        • product landscape
    • special application
      • Atlas 46s and 46r thick layer for electroplating
      • SXAR-N 4340-7 thermal stable negative resist
      • SXAR-P 3220-7 thick thermal stable
      • SXAR-P 3500-6 photoresist for holography
      • SXAR-P 3500-8 photoresist for high temperature
      • SXAR-P 3740-4 sub-um dip-coating photoresist
      • SXAR-P 5900/4 alkali stable photoresist
      • SXAR-P 8100.04/1 thermal-structurable resist
      • SXAR-PC 5000/22.2 protective coating
      • SXAR-PC 5000/40 KOH/HF protect coating
      • SXAR-PC 5000/80.2 non-photosensitive polyimide
      • SXAR-PC 5000/82.7 photosensitive polyimide
  • contact us
  • download
  • news
  • product-lineup
  • resist wiki
Techpoint Taiwan Corp.
  • home
    • about us
  • Product & Application
    • e-beam lithography
      • about Allresist e-Beam resist
        • a product landscape
        • allresist e-Beam resist - general
          • 1. overview
          • 2. type of polymer
          • 3. stability and optimum storage condition
        • detail process description
          • 0. Adhesion - substrate pretreatment
          • 1. Coating
          • 2. Tempering / Softbake
          • 3. Exposure
          • 4. Development
          • 5. Rinse
          • 6. Postbake / Hardbake
          • 7. Customer-specific technologies
          • 8. Removal
      • AR-N 7500 series - mix & match
      • AR-N 7520 series - mix & match
      • AR-N 7520-new series - mix & match
      • AR-N 7700 series with steep gradation
      • AR-N 7720 with flat gradation
      • AR-P 610 series copolymer resist
        • AR-P 617 features
        • correlation
        • liftoff process
        • Planarization
        • process baseline
        • Properties I
        • Properties II
        • reaction mechanism
        • spin curve
        • structure and resolution
      • AR-P 6200 series highest resolution
        • a. Features
        • b. Properties
        • c. Spin Curve
        • d. Structure & Resolution
        • e. Process Baseline
        • f. Plasma Etching Rate
        • g. Process Instruction
          • 01. ebeam exposure
          • 02. development
          • 03. lift-off structures
          • 04. high TH layer & special applications
        • h. Application Examples
          • 01. mask blanks
          • 02. plasmonic nanomaterials
          • 03. highest resolution nanolithography
          • 04. lift-off - high TH/high AR
          • 05. 2L lift-off structure
          • 06. high precision square structure
          • 07. development at lower temperature
          • 08 nano structures written with 100 kV
          • 09. developer for T-gate structure
        • i. Comparison vs. ZEP 520A
          • 01. resolution
          • 02. contrast
          • 03. sensitivity
      • AR-P 630-670 series PMMA resist
        • 2 layers PMMA structures
        • Application Example of PMMA resists
        • comparison-50k/200k vs 600k/950k
        • features
        • Process Baseline
        • properties
        • Reaction Mechanism
        • recommend on coating
        • Sensitivity & Acceleration Voltage
        • Specification of PMMA Resist
        • spin curve
        • structure resolution
        • Under-cut versus Dose
        • Undercut-application example
      • AR-P 6500 series ultra-high TH
        • coating instruction
        • features
        • process baseline
        • properties
        • structure and resolution
      • AR-P 7400 for mix & match
        • features
        • process baseline-negative
        • process baseline-positive
        • properties
        • spin curve
        • structure resolution
      • AR-PC 5090-5091 conductive coating
      • SXAR-N 7530/1 white light resist
      • SXAR-N 7700/30 high sensitive resist
      • SXAR-N 7730/1 high gradation
    • lithography process chemicals
      • adhesion promoter
        • adhesion strength
        • features
        • process baseline-ar300-80
        • process baseline-HMDS
        • properties
      • developer
      • remover
      • stopper
      • thinner
        • dilution and formula
        • features
        • properties
    • photoresist
      • AR-BR 5400 series bottom resist
      • AR-N 2200 series spray photoresist
      • AR-N 4200 mid-deep UV photoresist
      • AR-N 4300 std mid-UV photoresist
      • AR-N 4400 series thick layer photoresist
      • AR-P 1200 series spray photoresist
      • AR-P 3100 series photoresist for mask
      • AR-P 3200 series thick layer
      • AR-P 3500 series std photoresist for IC
      • AR-P 3700 std photoresist for IC
      • AR-P 3800 high resolution PR for IC
      • AR-P 5300 series photoresist for lift off
      • AR-P 5900 photoresist for HF etching
      • AR-PC 500 series protection coating
      • AR-U 4000 series image reversal resist
      • overview of photoresist
        • general information on photoresist
          • composition action mode & properties
          • stability & storage condition
          • waste & safety instruction
          • 0. positive photoresist
          • 1. image reversal resists
          • 2. negative photoresist
          • 3. thick layer photoresist
          • 4. lift-off applications
          • 5. Protective coatings
          • 6. special resist
          • 7. user-oriented photoresists
        • optimum process of photoresist
          • 0. Adhesion
          • 1. Coating
          • 2. Tempering / Softbake
          • 3. Exposure
          • 4. Development
          • 5. Rinse
          • 6. Postbake / hardbake
          • 7. Customer-specific technologies
          • 8. Removal
        • product landscape
    • special application
      • Atlas 46s and 46r thick layer for electroplating
      • SXAR-N 4340-7 thermal stable negative resist
      • SXAR-P 3220-7 thick thermal stable
      • SXAR-P 3500-6 photoresist for holography
      • SXAR-P 3500-8 photoresist for high temperature
      • SXAR-P 3740-4 sub-um dip-coating photoresist
      • SXAR-P 5900/4 alkali stable photoresist
      • SXAR-P 8100.04/1 thermal-structurable resist
      • SXAR-PC 5000/22.2 protective coating
      • SXAR-PC 5000/40 KOH/HF protect coating
      • SXAR-PC 5000/80.2 non-photosensitive polyimide
      • SXAR-PC 5000/82.7 photosensitive polyimide
  • contact us
  • download
  • news
  • product-lineup
  • resist wiki
  • More
    • home
      • about us
    • Product & Application
      • e-beam lithography
        • about Allresist e-Beam resist
          • a product landscape
          • allresist e-Beam resist - general
            • 1. overview
            • 2. type of polymer
            • 3. stability and optimum storage condition
          • detail process description
            • 0. Adhesion - substrate pretreatment
            • 1. Coating
            • 2. Tempering / Softbake
            • 3. Exposure
            • 4. Development
            • 5. Rinse
            • 6. Postbake / Hardbake
            • 7. Customer-specific technologies
            • 8. Removal
        • AR-N 7500 series - mix & match
        • AR-N 7520 series - mix & match
        • AR-N 7520-new series - mix & match
        • AR-N 7700 series with steep gradation
        • AR-N 7720 with flat gradation
        • AR-P 610 series copolymer resist
          • AR-P 617 features
          • correlation
          • liftoff process
          • Planarization
          • process baseline
          • Properties I
          • Properties II
          • reaction mechanism
          • spin curve
          • structure and resolution
        • AR-P 6200 series highest resolution
          • a. Features
          • b. Properties
          • c. Spin Curve
          • d. Structure & Resolution
          • e. Process Baseline
          • f. Plasma Etching Rate
          • g. Process Instruction
            • 01. ebeam exposure
            • 02. development
            • 03. lift-off structures
            • 04. high TH layer & special applications
          • h. Application Examples
            • 01. mask blanks
            • 02. plasmonic nanomaterials
            • 03. highest resolution nanolithography
            • 04. lift-off - high TH/high AR
            • 05. 2L lift-off structure
            • 06. high precision square structure
            • 07. development at lower temperature
            • 08 nano structures written with 100 kV
            • 09. developer for T-gate structure
          • i. Comparison vs. ZEP 520A
            • 01. resolution
            • 02. contrast
            • 03. sensitivity
        • AR-P 630-670 series PMMA resist
          • 2 layers PMMA structures
          • Application Example of PMMA resists
          • comparison-50k/200k vs 600k/950k
          • features
          • Process Baseline
          • properties
          • Reaction Mechanism
          • recommend on coating
          • Sensitivity & Acceleration Voltage
          • Specification of PMMA Resist
          • spin curve
          • structure resolution
          • Under-cut versus Dose
          • Undercut-application example
        • AR-P 6500 series ultra-high TH
          • coating instruction
          • features
          • process baseline
          • properties
          • structure and resolution
        • AR-P 7400 for mix & match
          • features
          • process baseline-negative
          • process baseline-positive
          • properties
          • spin curve
          • structure resolution
        • AR-PC 5090-5091 conductive coating
        • SXAR-N 7530/1 white light resist
        • SXAR-N 7700/30 high sensitive resist
        • SXAR-N 7730/1 high gradation
      • lithography process chemicals
        • adhesion promoter
          • adhesion strength
          • features
          • process baseline-ar300-80
          • process baseline-HMDS
          • properties
        • developer
        • remover
        • stopper
        • thinner
          • dilution and formula
          • features
          • properties
      • photoresist
        • AR-BR 5400 series bottom resist
        • AR-N 2200 series spray photoresist
        • AR-N 4200 mid-deep UV photoresist
        • AR-N 4300 std mid-UV photoresist
        • AR-N 4400 series thick layer photoresist
        • AR-P 1200 series spray photoresist
        • AR-P 3100 series photoresist for mask
        • AR-P 3200 series thick layer
        • AR-P 3500 series std photoresist for IC
        • AR-P 3700 std photoresist for IC
        • AR-P 3800 high resolution PR for IC
        • AR-P 5300 series photoresist for lift off
        • AR-P 5900 photoresist for HF etching
        • AR-PC 500 series protection coating
        • AR-U 4000 series image reversal resist
        • overview of photoresist
          • general information on photoresist
            • composition action mode & properties
            • stability & storage condition
            • waste & safety instruction
            • 0. positive photoresist
            • 1. image reversal resists
            • 2. negative photoresist
            • 3. thick layer photoresist
            • 4. lift-off applications
            • 5. Protective coatings
            • 6. special resist
            • 7. user-oriented photoresists
          • optimum process of photoresist
            • 0. Adhesion
            • 1. Coating
            • 2. Tempering / Softbake
            • 3. Exposure
            • 4. Development
            • 5. Rinse
            • 6. Postbake / hardbake
            • 7. Customer-specific technologies
            • 8. Removal
          • product landscape
      • special application
        • Atlas 46s and 46r thick layer for electroplating
        • SXAR-N 4340-7 thermal stable negative resist
        • SXAR-P 3220-7 thick thermal stable
        • SXAR-P 3500-6 photoresist for holography
        • SXAR-P 3500-8 photoresist for high temperature
        • SXAR-P 3740-4 sub-um dip-coating photoresist
        • SXAR-P 5900/4 alkali stable photoresist
        • SXAR-P 8100.04/1 thermal-structurable resist
        • SXAR-PC 5000/22.2 protective coating
        • SXAR-PC 5000/40 KOH/HF protect coating
        • SXAR-PC 5000/80.2 non-photosensitive polyimide
        • SXAR-PC 5000/82.7 photosensitive polyimide
    • contact us
    • download
    • news
    • product-lineup
    • resist wiki

spin curve

AR-P 630-670 series PMMA resist

Features

Properties

Spin Curve

Structure & Resolution

Process Baseline

Lift-off Application

recommend on coating

2 layers PMMA structures

compare-50k/200k vs 600/950k

under-cut versus Dose

undercut-application example

Sensitivity & Acceleration Voltage

Reaction Mechanism & Gradation

Specification of PMMA Resist

Application Example of PMMA resists

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