6. Postbake / Hardbake

6. postbake / hardbake

Postbake / Hardbake

For specific process steps, a postbake at approximately 115 °C (novolac-based) or at 180 °C (PMMA-based) leads to a higher etch stability during wet-chemical and plasma-chemical etching procedures. Higher temperatures are possible for stronger etch conditions, may however result in a rounding of resist profiles.