2. Tempering / Softbake

2. tempering / softbake

Tempering / Softbake

Newly coated resists films still contain, depending on the film thickness, a certain amount of residual solvent. A subsequent tempering at 85 – 210 °C is performed to dry and to harden the resist films. In addition to improved resist adhesion properties, also the dark erosion during development is reduced.

If temperature-sensitive substrates are processed it is also possible to work at considerably lower softbake temperatures (< 60 °C). The development regime has to be adjusted accordingly.

After the softbake, substrates are cooled to room temperature prior to further use.