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Techpoint Taiwan Corp.
home
about us
Product & Application
e-beam lithography
about Allresist e-Beam resist
a product landscape
allresist e-Beam resist - general
1. overview
2. type of polymer
3. stability and optimum storage condition
detail process description
0. Adhesion - substrate pretreatment
1. Coating
2. Tempering / Softbake
3. Exposure
4. Development
5. Rinse
6. Postbake / Hardbake
7. Customer-specific technologies
8. Removal
AR-N 7500 series - mix & match
AR-N 7520 series - mix & match
AR-N 7520-new series - mix & match
AR-N 7700 series with steep gradation
AR-N 7720 with flat gradation
AR-P 610 series copolymer resist
AR-P 617 features
correlation
liftoff process
Planarization
process baseline
Properties I
Properties II
reaction mechanism
spin curve
structure and resolution
AR-P 6200 series highest resolution
a. Features
b. Properties
c. Spin Curve
d. Structure & Resolution
e. Process Baseline
f. Plasma Etching Rate
g. Process Instruction
01. ebeam exposure
02. development
03. lift-off structures
04. high TH layer & special applications
h. Application Examples
01. mask blanks
02. plasmonic nanomaterials
03. highest resolution nanolithography
04. lift-off - high TH/high AR
05. 2L lift-off structure
06. high precision square structure
07. development at lower temperature
08 nano structures written with 100 kV
09. developer for T-gate structure
i. Comparison vs. ZEP 520A
01. resolution
02. contrast
03. sensitivity
AR-P 630-670 series PMMA resist
2 layers PMMA structures
Application Example of PMMA resists
comparison-50k/200k vs 600k/950k
features
Process Baseline
properties
Reaction Mechanism
recommend on coating
Sensitivity & Acceleration Voltage
Specification of PMMA Resist
spin curve
structure resolution
Under-cut versus Dose
Undercut-application example
AR-P 6500 series ultra-high TH
coating instruction
features
process baseline
properties
structure and resolution
AR-P 7400 for mix & match
features
process baseline-negative
process baseline-positive
properties
spin curve
structure resolution
AR-PC 5090-5091 conductive coating
SXAR-N 7530/1 white light resist
SXAR-N 7700/30 high sensitive resist
SXAR-N 7730/1 high gradation
lithography process chemicals
adhesion promoter
adhesion strength
features
process baseline-ar300-80
process baseline-HMDS
properties
developer
remover
stopper
thinner
dilution and formula
features
properties
photoresist
AR-BR 5400 series bottom resist
AR-N 2200 series spray photoresist
AR-N 4200 mid-deep UV photoresist
AR-N 4300 std mid-UV photoresist
AR-N 4400 series thick layer photoresist
AR-P 1200 series spray photoresist
AR-P 3100 series photoresist for mask
AR-P 3200 series thick layer
AR-P 3500 series std photoresist for IC
AR-P 3700 std photoresist for IC
AR-P 3800 high resolution PR for IC
AR-P 5300 series photoresist for lift off
AR-P 5900 photoresist for HF etching
AR-PC 500 series protection coating
AR-U 4000 series image reversal resist
overview of photoresist
general information on photoresist
composition action mode & properties
stability & storage condition
waste & safety instruction
0. positive photoresist
1. image reversal resists
2. negative photoresist
3. thick layer photoresist
4. lift-off applications
5. Protective coatings
6. special resist
7. user-oriented photoresists
optimum process of photoresist
0. Adhesion
1. Coating
2. Tempering / Softbake
3. Exposure
4. Development
5. Rinse
6. Postbake / hardbake
7. Customer-specific technologies
8. Removal
product landscape
special application
Atlas 46s and 46r thick layer for electroplating
SXAR-N 4340-7 thermal stable negative resist
SXAR-P 3220-7 thick thermal stable
SXAR-P 3500-6 photoresist for holography
SXAR-P 3500-8 photoresist for high temperature
SXAR-P 3740-4 sub-um dip-coating photoresist
SXAR-P 5900/4 alkali stable photoresist
SXAR-P 8100.04/1 thermal-structurable resist
SXAR-PC 5000/22.2 protective coating
SXAR-PC 5000/40 KOH/HF protect coating
SXAR-PC 5000/80.2 non-photosensitive polyimide
SXAR-PC 5000/82.7 photosensitive polyimide
contact us
download
news
product-lineup
resist wiki
Techpoint Taiwan Corp.
home
about us
Product & Application
e-beam lithography
about Allresist e-Beam resist
a product landscape
allresist e-Beam resist - general
1. overview
2. type of polymer
3. stability and optimum storage condition
detail process description
0. Adhesion - substrate pretreatment
1. Coating
2. Tempering / Softbake
3. Exposure
4. Development
5. Rinse
6. Postbake / Hardbake
7. Customer-specific technologies
8. Removal
AR-N 7500 series - mix & match
AR-N 7520 series - mix & match
AR-N 7520-new series - mix & match
AR-N 7700 series with steep gradation
AR-N 7720 with flat gradation
AR-P 610 series copolymer resist
AR-P 617 features
correlation
liftoff process
Planarization
process baseline
Properties I
Properties II
reaction mechanism
spin curve
structure and resolution
AR-P 6200 series highest resolution
a. Features
b. Properties
c. Spin Curve
d. Structure & Resolution
e. Process Baseline
f. Plasma Etching Rate
g. Process Instruction
01. ebeam exposure
02. development
03. lift-off structures
04. high TH layer & special applications
h. Application Examples
01. mask blanks
02. plasmonic nanomaterials
03. highest resolution nanolithography
04. lift-off - high TH/high AR
05. 2L lift-off structure
06. high precision square structure
07. development at lower temperature
08 nano structures written with 100 kV
09. developer for T-gate structure
i. Comparison vs. ZEP 520A
01. resolution
02. contrast
03. sensitivity
AR-P 630-670 series PMMA resist
2 layers PMMA structures
Application Example of PMMA resists
comparison-50k/200k vs 600k/950k
features
Process Baseline
properties
Reaction Mechanism
recommend on coating
Sensitivity & Acceleration Voltage
Specification of PMMA Resist
spin curve
structure resolution
Under-cut versus Dose
Undercut-application example
AR-P 6500 series ultra-high TH
coating instruction
features
process baseline
properties
structure and resolution
AR-P 7400 for mix & match
features
process baseline-negative
process baseline-positive
properties
spin curve
structure resolution
AR-PC 5090-5091 conductive coating
SXAR-N 7530/1 white light resist
SXAR-N 7700/30 high sensitive resist
SXAR-N 7730/1 high gradation
lithography process chemicals
adhesion promoter
adhesion strength
features
process baseline-ar300-80
process baseline-HMDS
properties
developer
remover
stopper
thinner
dilution and formula
features
properties
photoresist
AR-BR 5400 series bottom resist
AR-N 2200 series spray photoresist
AR-N 4200 mid-deep UV photoresist
AR-N 4300 std mid-UV photoresist
AR-N 4400 series thick layer photoresist
AR-P 1200 series spray photoresist
AR-P 3100 series photoresist for mask
AR-P 3200 series thick layer
AR-P 3500 series std photoresist for IC
AR-P 3700 std photoresist for IC
AR-P 3800 high resolution PR for IC
AR-P 5300 series photoresist for lift off
AR-P 5900 photoresist for HF etching
AR-PC 500 series protection coating
AR-U 4000 series image reversal resist
overview of photoresist
general information on photoresist
composition action mode & properties
stability & storage condition
waste & safety instruction
0. positive photoresist
1. image reversal resists
2. negative photoresist
3. thick layer photoresist
4. lift-off applications
5. Protective coatings
6. special resist
7. user-oriented photoresists
optimum process of photoresist
0. Adhesion
1. Coating
2. Tempering / Softbake
3. Exposure
4. Development
5. Rinse
6. Postbake / hardbake
7. Customer-specific technologies
8. Removal
product landscape
special application
Atlas 46s and 46r thick layer for electroplating
SXAR-N 4340-7 thermal stable negative resist
SXAR-P 3220-7 thick thermal stable
SXAR-P 3500-6 photoresist for holography
SXAR-P 3500-8 photoresist for high temperature
SXAR-P 3740-4 sub-um dip-coating photoresist
SXAR-P 5900/4 alkali stable photoresist
SXAR-P 8100.04/1 thermal-structurable resist
SXAR-PC 5000/22.2 protective coating
SXAR-PC 5000/40 KOH/HF protect coating
SXAR-PC 5000/80.2 non-photosensitive polyimide
SXAR-PC 5000/82.7 photosensitive polyimide
contact us
download
news
product-lineup
resist wiki
More
home
about us
Product & Application
e-beam lithography
about Allresist e-Beam resist
a product landscape
allresist e-Beam resist - general
1. overview
2. type of polymer
3. stability and optimum storage condition
detail process description
0. Adhesion - substrate pretreatment
1. Coating
2. Tempering / Softbake
3. Exposure
4. Development
5. Rinse
6. Postbake / Hardbake
7. Customer-specific technologies
8. Removal
AR-N 7500 series - mix & match
AR-N 7520 series - mix & match
AR-N 7520-new series - mix & match
AR-N 7700 series with steep gradation
AR-N 7720 with flat gradation
AR-P 610 series copolymer resist
AR-P 617 features
correlation
liftoff process
Planarization
process baseline
Properties I
Properties II
reaction mechanism
spin curve
structure and resolution
AR-P 6200 series highest resolution
a. Features
b. Properties
c. Spin Curve
d. Structure & Resolution
e. Process Baseline
f. Plasma Etching Rate
g. Process Instruction
01. ebeam exposure
02. development
03. lift-off structures
04. high TH layer & special applications
h. Application Examples
01. mask blanks
02. plasmonic nanomaterials
03. highest resolution nanolithography
04. lift-off - high TH/high AR
05. 2L lift-off structure
06. high precision square structure
07. development at lower temperature
08 nano structures written with 100 kV
09. developer for T-gate structure
i. Comparison vs. ZEP 520A
01. resolution
02. contrast
03. sensitivity
AR-P 630-670 series PMMA resist
2 layers PMMA structures
Application Example of PMMA resists
comparison-50k/200k vs 600k/950k
features
Process Baseline
properties
Reaction Mechanism
recommend on coating
Sensitivity & Acceleration Voltage
Specification of PMMA Resist
spin curve
structure resolution
Under-cut versus Dose
Undercut-application example
AR-P 6500 series ultra-high TH
coating instruction
features
process baseline
properties
structure and resolution
AR-P 7400 for mix & match
features
process baseline-negative
process baseline-positive
properties
spin curve
structure resolution
AR-PC 5090-5091 conductive coating
SXAR-N 7530/1 white light resist
SXAR-N 7700/30 high sensitive resist
SXAR-N 7730/1 high gradation
lithography process chemicals
adhesion promoter
adhesion strength
features
process baseline-ar300-80
process baseline-HMDS
properties
developer
remover
stopper
thinner
dilution and formula
features
properties
photoresist
AR-BR 5400 series bottom resist
AR-N 2200 series spray photoresist
AR-N 4200 mid-deep UV photoresist
AR-N 4300 std mid-UV photoresist
AR-N 4400 series thick layer photoresist
AR-P 1200 series spray photoresist
AR-P 3100 series photoresist for mask
AR-P 3200 series thick layer
AR-P 3500 series std photoresist for IC
AR-P 3700 std photoresist for IC
AR-P 3800 high resolution PR for IC
AR-P 5300 series photoresist for lift off
AR-P 5900 photoresist for HF etching
AR-PC 500 series protection coating
AR-U 4000 series image reversal resist
overview of photoresist
general information on photoresist
composition action mode & properties
stability & storage condition
waste & safety instruction
0. positive photoresist
1. image reversal resists
2. negative photoresist
3. thick layer photoresist
4. lift-off applications
5. Protective coatings
6. special resist
7. user-oriented photoresists
optimum process of photoresist
0. Adhesion
1. Coating
2. Tempering / Softbake
3. Exposure
4. Development
5. Rinse
6. Postbake / hardbake
7. Customer-specific technologies
8. Removal
product landscape
special application
Atlas 46s and 46r thick layer for electroplating
SXAR-N 4340-7 thermal stable negative resist
SXAR-P 3220-7 thick thermal stable
SXAR-P 3500-6 photoresist for holography
SXAR-P 3500-8 photoresist for high temperature
SXAR-P 3740-4 sub-um dip-coating photoresist
SXAR-P 5900/4 alkali stable photoresist
SXAR-P 8100.04/1 thermal-structurable resist
SXAR-PC 5000/22.2 protective coating
SXAR-PC 5000/40 KOH/HF protect coating
SXAR-PC 5000/80.2 non-photosensitive polyimide
SXAR-PC 5000/82.7 photosensitive polyimide
contact us
download
news
product-lineup
resist wiki
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